CMOS with dual raised source and drain for NMOS and PMOS

ABSTRACT

An apparatus and a method for creating a CMOS with a dual raised source and drain for NMOS and PMOS. The spacers on both stack gates are of equal thickness. In this method, a first insulating layer is formed on the surface. The first region is then masked while the other region has the first layer etched away and has an epitaxial source and drain grown on the region. A second layer is formed to all exposed surfaces. The second region is then masked while the first region is etched away. The epitaxial source and drain is formed on the first region. The second region can also be masked by adding a thin layer of undoped silicon and then oxidize it. Another way to mask the second region is to use a hard mask. Another way to form the second source and drain is to use amorphous material.

DOMESTIC PRIORITY

This application is a divisional of U.S. patent application Ser. No.13/179,990, filed Jul. 11, 2011, the disclosure of which is incorporatedby reference herein in its entirety.

BACKGROUND

The present invention relates generally to Complementary Metal OxideSemiconductor (CMOS) devices and, more particularly, to CMOS integrationon extremely thin silicon on insulator (ETSOI) with dual raised sourceand drain on both nFET and pFET.

CMOS technology is employed in almost every electronic circuitapplication. One type of CMOS technology employs Silicon-On-Insulator(SOI) substrates in place of conventional silicon. The benefit of SOIover conventional silicon is the reduced parasitic capacitance thatleads to improved performance. The implementation of SOI technology hasallowed for the continued scaling planar silicon technology.

Extremely Thin Silicon-On-Insulator (ETSOI) is a leading candidate forfurther continued scaling of planar silicon technology. However, thesuccessful introduction of ETSOI in manufacturing requires integrationof negative-type field effect transistors (nFET) and positive-type fieldeffect transistors (pFET) with high performance and low leakage.

A key feature to improve performance and reduce series resistance inETSOI is the use of raised source/drain (RSD) epitaxy. In RSD epitaxy,the source and drain regions are formed above the channel region toobtain low series resistance. Formation of RSD requires the use ofspacers. Current approaches to RSD integration on ETSOI planar devicesrely on differential spacer thickness on the nFET and the pFET.

A drawback of the nFET and the pFET having differential spacer thicknessis that it increases the scale of the device. It is desirable to have tohave the same spacer thickness on both the nFET and the pFET. There is aneed for an improved CMOS device and method of manufacturing the same.

SUMMARY

In consideration of the foregoing, the present invention providesmethods and an apparatus for creating a Complementary Metal OxideSemiconductor (CMOS) structure with two Raised Source Drain (RSD)structures, wherein the spacers have an equal thickness.

In one aspect of the invention, the method for creating a dual RSD CMOSwith equal spacer thickness includes providing a silicon-on-insulatorsubstrate having a first substrate surface in a first region and asecond substrate surface in a second region, wherein the first substratesurface and the second substrate surface are isolated by a shallowtrench isolation, forming a first gate stack on the first substratesurface and a second gate stack on the second substrate surface, forminga first insulating layer on all exposed surfaces in the first and secondregions, etching the insulating layer in the second region to forminsulating spacers on sidewalls of the second gate stack, formingepitaxial source and drain layers on the second substrate surface,forming a second insulating layer on all exposed surfaces in the firstand second regions, removing the second insulating layer in the firstregion to expose the first insulating layer, etching the first insultinglayer in order to form insulating spacers on sidewalls of the first gatestack and expose the first substrate surface, forming undoped epitaxialsource and drain layers on the first substrate surface, implanting adopant into the source and drain layers on the first substrate surface,removing the second insulating layer in the second region, if the sourceand drain layers on the second substrate surface are undoped, implantinga dopant into the source and drain layers on the second substratesurface and forming silicide contacts on the source and drain layers inboth the first and second regions and on the first and second gatestacks.

In another aspect, the method for creating a dual RSD CMOS with equalspacer thickness includes providing a silicon-on-insulator substratehaving a first substrate surface in a first region and a secondsubstrate surface in a second region, wherein the first substratesurface and the second substrate surface are isolated by a shallowtrench isolation, forming a first gate stack on the first substratesurface and a second gate stack on the second substrate surface, forminga first insulating layer on all exposed surfaces in the first and secondregions, etching the first insulating layer in the second region to forminsulating spacers on sidewalls of the second gate stack, formingepitaxial source and drain layers on the second substrate surface,forming a layer of undoped epitaxial silicon on the source and drainlayers on the second substrate surface, oxidizing a top surface of thelayer of undoped epitaxial silicon to form a hard mask layer, etchingthe first insulating layer in the first region to form insulatingspacers on sidewalls of the first gate stack and to expose the firstsubstrate surface, forming in-situ doped epitaxial source and drainlayers on the first substrate surface, removing the oxidized layer ofundoped epitaxial silicon on the source and drain layers on the secondsubstrate, if the source and drain layers on the second substratesurface are undoped, implanting a dopant into the source and drainlayers on the second substrate surface and forming silicide contacts onthe source and drain layers in both the first and second regions and onthe first and second gate stacks.

In yet another aspect, the method for creating a dual RSD CMOS withequal spacer thickness includes providing a silicon-on-insulatorsubstrate having a first substrate surface in a first region and asecond substrate surface in a second region, wherein the first substratesurface and the second substrate surface are isolated by a shallowtrench isolation, forming a first gate stack on the first substratesurface and a second gate stack on the second substrate surface, forminga first insulating layer on all exposed surfaces in the first and secondregions, etching the first insulating layer in the second region to forminsulating spacers on sidewalls of the second gate stack, formingepitaxial source and drain layers on the second substrate surface,forming a thin amorphous layer on the source and drain layers on thesecond substrate surface, etching the first insulating layer in thefirst region to form insulating spacers on sidewalls of the first gatestack and to expose the first substrate surface, forming in-situ dopedepitaxial source and drain layers on the first substrate surface,removing the thin amorphous layer and any amorphous material that formedduring the formation of the in-situ doped epitaxial source and drainlayers and forming silicide contacts on the source and drain layers inboth the first and second regions and on the first and second gatestacks.

In another aspect, the method for creating a dual RSD CMOS with equalspacer thickness includes providing a silicon-on-insulator substratehaving a first substrate surface in a first region and a secondsubstrate surface in a second region, wherein the first substratesurface and the second substrate surface are isolated by a shallowtrench isolation, forming a first gate stack on the first substratesurface and a second gate stack on the second substrate surface, forminga first insulating layer on all exposed surfaces in the first and secondregions, etching the first insulating layer in the second region to forminsulating spacers on sidewalls of the second gate stack, formingepitaxial source and drain layers on the second substrate surface,forming a hard mask layer on all exposed surfaces in the first andsecond regions, removing the hard mask layer in the first region toexpose the first insulating layer, etching the first insulating layer inorder to form insulating spacers on sidewalls of the first gate stackand expose the first substrate surface, forming epitaxial source anddrain layers on the first substrate surface, removing the hard masklayer in the second region and forming silicide contacts on the sourceand drain layers in both the first and second regions and on the firstand second gate stacks.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a more complete understanding of the present invention and theadvantage thereof, reference is now made to the following descriptiontaken in conjunction with the accompanying drawings:

FIGS. 1A, 1B and 1C are a cross-sectional representation of the maskingand etching of a CMOS structure to form the first spacer.

FIG. 2 is a cross-sectional representation of a RSD after epitaxy.

FIGS. 3A, 3B and 3C are a cross-sectional representation of the maskingand etching of the CMOS structure to form the second spacer according toa first embodiment of the invention.

FIG. 3D is a cross-sectional representation of the dual RSD structure.

FIG. 3E is a cross-sectional representation of the dual structure withanother spacer and silicide contacts.

FIGS. 4A, 4B and 4C are a cross-sectional representation of the maskingand etching of the CMOS structure to form the second spacer according toa second embodiment of the invention.

FIG. 4D is a cross-sectional representation of a RSD after epitaxy.

FIG. 4E is a cross-sectional representation of the dual structure withanother spacer and silicide contacts.

FIGS. 5A, 5B and 5C are a cross-sectional representation of the maskingand etching of the CMOS structure to form the second spacer according toa third embodiment of the invention.

FIG. 5D is a cross-sectional representation of a RSD after epitaxy.

FIGS. 6A, 6B and 6C are a cross-sectional representation of the maskingand etching of the CMOS structure to form the second spacer according toa fourth embodiment of the invention.

FIG. 6D is a cross-sectional representation of a RSD after epitaxy.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present invention will be described byreferring to the accompanying drawings.

For all aspects, the “first region” and “second region” refer to FETregions of a CMOS device. The first region can be an nFET or a pFET andaccordingly the second region is oppositely doped. Thus, if the firstregion is an nFET, the second region is a pFET or vice versa. Acceptabledopants for an nFET include, but are not limited to, phosphorus,arsenic, or both. An example dopant concentration includes from about1E19 atoms/cm³ to about 8E21 atoms/cm³ and is preferably 5E20 atoms/cm³.Acceptable dopants of a pFET include, but are not limited to, boron andboron difluoride (BF₂). An example dopant concentration includes fromabout 1E19 atoms/cm³ to about 5E21 atoms/cm³ and is preferably 8E20.

FIG. 1A shows a CMOS structure with two FET portions: one portion beinga n-type field effect transistor (nFET) portion and a second portionbeing a p-type field effect transistor (pFET) portion. The nFET portionand the pFET portion are isolated by a shallow trench isolation (STI)(100). The nFET portion and pFET portion rest on top of a substratelayer. The substrate layer can be a semiconductor on insulator substrate(SOI).

In general, SOI substrates are made of three parts: a bottom bulksemiconductor layer, a buried oxide layer (BOX) and a semiconductorlayer on top of the BOX. In this application, the semiconductor layer ontop of the BOX is referred to as the “ETSOI” or “ETSOI layer”. The SOIsubstrate as a whole (i.e. all three layers: SUBSTRATE, BOX and ETSOIare referred to as “SOT substrate”. Note, with an SOT substrate, a topsurface of the substrate is equivalent to the top surface of the ETSOIlayer.

According to the present invention, the SOT substrate has a preferablethickness equal to or less than 120 nm. The nFET and pFET portion eachhave a gate stack (102, 202) and a gate nitride cap (106, 206) formed ontop of the ETSOI surface. The gate stack may include an SiO2 containinginterfacial layer of about 2-40 A with a preferred thickness of about 6A. A high k layer made of hafnium oxide, hafnium silicate, hafniumsilicon oxynitride layer, zirconium oxide etc. with thickness of range10 A to 50 A with a preferred thickness of about 2 nm. The gate nitridecap may be from 1 nm thick to 50 nm thick and is preferably 30 nm thick.

Forming the First Raised Source Drain

In FIG. 1A, according to the proposed method, a first insulating layer(110) is deposited over the substrate. The first insulating layer iscomposed of a bottom silicon nitride (112) and a top furnace nitride(114). The silicon nitride film can be deposited by plasma enhancedchemical vapor deposition (PECVD), Rapid Thermal Chemical VaporDeposition (RTCVD), or Low Pressure Chemical Vapor Deposition (LPCVD).The thickness of the silicon nitride layer is in the range of 1 to 50 nmwith a preferred thickness of about 15 nm.

FIG. 1B illustrates the etching of the pFET region. After the firstinsulating layer (110) is formed, the nFET region is masked with a mask(120) using a lithography process. The first insulating layer (110) inthe pFET region is etched away to form the sidewall spacers (208) on thesidewall of the pFET region.

FIG. 1C illustrates the sidewall spacers (208). After the etching isdone, the ETSOI surface in the pFET region is exposed and sidewallspacers (208) are on the side of the pFET gate stack. The sidewallspacers (208) are composed of a silicon nitride (112) and furnacenitride (114) on the side of the gate stack (202). The pFET sidewallspacer thickness of both the nitride layers is from about 6 nm to about30 nm.

FIG. 2 illustrates the raised source drain (250) on the pFET region. Theraised source drain (250) is then grown using in-situ doping on theETSOI of the pFET region. Suitable raised source drain material for apFET can be SiGe or Si and is preferably SiGe. Suitable raised soureddrain material for an nFET can by Si or SiC. The thickness of the raisedsource drain is from about 5 nm to about 70 nm, preferably 35 nm. Afterthe sidewall spacers are formed, the mask (120) from the nFET region isremoved. A doped epitaxial growth is applied to the pFET region to formthe first RSD (250).

Forming the Second Raised Source Drain Using a Second Insulating Layer

FIG. 3A illustrates the second insulating layer and masking of the pFETregion with a mask (120). After the first RSD is grown and a secondinsulating layer (116) is applied to the substrate layer on the nFET andpFET regions, the mask (120) is applied to the pFET region. The secondinsulating layer (116) can be selected from, but not limited to, siliconnitride, hafnium oxide (HfO₂), zirconium oxide (ZrO₂), or aluminum oxide(AlO₂). In a preferred embodiment the second insulating film (116) issilicon nitride. In a further preference, the silicon nitride film isdeposited at 630° C. by a Chemical Vapor Deposition (CVD) process. Thesecond insulating film (116) can have a thickness from about 1 nm toabout 50 nm. Preferably the second insulating layer is 20 nm.

FIG. 3B shows the etching of the nFET region. The pFET is protected by amask (120) while the second insulating layer (116) is then removed byetching from the nFET region to expose the first insulating layer (110).The first insulating layer (110) is then wet etched from the nFETportion to form insulating sidewall spacers (108) on the sidewalls ofthe first gate stack and expose the ETSOI surface. The nFET sidewallspacer total thickness of both the nitride layers is from about 6 nm toabout 30 nm.

FIG. 3C shows the CMOS structure without the mask (120). The mask (120)from the pFET region is then removed by wetting the photoresist. In FIG.3D, an undoped epitaxial RSD layer is then applied on the ETSOI surfaceof the nFET region to create the second RSD (150). The epitaxial RSD(150) on the nFET are then doped. The height of the raised source drainis from about 7 nm to about 60 nm and is preferably 30 nm.

FIG. 3E illustrates the dual RSD CMOS structure. The second insulatinglayer (116) in the pFET region is removed by etching. Note that thesidewall spacers (108, 208) on both gate stacks will be of equalthickness. A dopant will be applied if the pFET is undoped. A second setof spacers (170, 270) are formed on top the insulating spacers bydepositing SiNi film. A highly directional dry etch process is used toremove the SiNi film from the horizontal surfaces, which leaves thesecond spacer. Finally, silicide contacts (180, 280) are formed on theRSD layers of the pFET and nFET. Acceptable silicide could be nickel andsilicide thickness is from about 5 nm to about 55 nm, preferably 15 nm.

Forming the Second Raised Source Drain Using Oxidation

FIG. 2 illustrates the first RSD structure. The CMOS structure is formedas previously described by providing a SOI substrate having a firstsubstrate surface in a first region and a second substrate surface in asecond region, wherein the first substrate surface and the secondsubstrate surface are isolated by a shallow trench isolation, forming afirst gate stack on the first substrate surface and a second gate stackon the second substrate surface, forming a first insulating layer on allexposed surfaces in the first and second regions, etching the firstinsulating layer in the second region to form insulating spacers onsidewalls of the second gate stack, and forming epitaxial source anddrain layers on the second substrate surface.

FIG. 4A illustrates the undoped silicon layer (300) applied to the nFETregion. Instead of adding a second insulating layer, a thin layer ofundoped silicon (300) on top of the first source and drain on the nFETregion. The silicon is deposited by selective epitaxial CVD method. Thethickness of the silicon can be from about 5 nm to about 50 nm andpreferably 35 nm.

FIG. 4B illustrates the hard mask layer (302) on the nFET region. Theundoped layer is then oxidized to form a hard mask layer (302). Theoxidization allows for controlling the thickness of the hard mask layer(302) in a precise manner. The hard mask layer (302) acts to protect thenFET source and drain while the first insulating layer of the pFET getsetched away. No mask or strip resist is needed to cover the nFET sourceand drain from the etching. The thickness of the hardmask can be fromabout 3 nm to about 50 nm and preferably 15 nm.

FIG. 4C illustrates the spacer formation on the pFET region. The etchingof the pFET region creates the insulating spacers on the sidewalls ofthe gate stack and exposes the first substrate surface. FIG. 4Dillustrates the second RSD on the pFET region. The second epitaxial RSD(250) is then in-situ doped while the hard mask layer (302) is still ontop of the nFET region. If the source and drain layers on nFET surfaceare undoped, a dopant will be implanted. FIG. 4E illustrates the finalproduct. The hard mask layer (302) is removed by etching. Finally,silicide contacts (180, 280) and another spacer (270,270) are formed onthe source and drain layers of the pFET and nFET as previouslydescribed.

Forming the Second Raised Source Drain Using an Amorphous Layer

FIG. 2 illustrates the first RSD structure. The CMOS structure is formedas previously described by providing a SOI substrate having a firstsubstrate surface in a first region and a second substrate surface in asecond region, wherein the first substrate surface and the secondsubstrate surface are isolated by a shallow trench isolation, forming afirst gate stack on the first substrate surface and a second gate stackon the second substrate surface, forming a first insulating layer on allexposed surfaces in the first and second regions, etching the firstinsulating layer in the second region to form insulating spacers onsidewalls of the second gate stack, and forming epitaxial source anddrain layers on the second substrate surface.

FIG. 5A shows the thin amorphous layer (510). The embodiment describesforming a thin amorphous layer (510) of silicon on the raised source anddrain layers (250) on the pFET region. Alternatively, the amorphouslayer (510) can also be formed by implanting a neutral species into theepitaxial source and drain layers to convert a top layer into theamorphous layer. The amorphous layer has a thickness from about 3 nm toabout 20 nm; preferably 10 nm.

In FIG. 5B, the first insulating layer (110) is etched in the nFETregion to form insulating spacers (108) on sidewalls of the nFET gatestack and to expose the first substrate surface. The etching can be donewith or without masking the pFET, depending on the selectivity of theSiN to the amorphous silicon. The etch is a dry etch as is known in theart of etching SiN spacers. This is done by using a dry directionalReactive Ion Etching (RIE) process composed of CF₈, or CH₂F₂ or otherchemistry as is known to etch silicon nitride selective to silicon.

FIG. 5C shows the formation of the RSD (150) on the nFET region. Thedoped epitaxial RSD layers (150) are formed in-situ on the nFET region.The height of the raised source drains is as previously described. InFIG. 5D, the thin amorphous layer over the pFET and any amorphousmaterial that formed during the formation of the in-situ doped epitaxialRSD layers (150, 250) are then removed by wet etching. Alternatively,instead of having to do a separate raised source and drain growth andthen raised source and drain etching, the doped epitaxial source anddrain layers can be formed by simultaneously growing the epitaxial filmand in-situ etching any amorphous silicon carbide. The insitu dopedsilicon carbide growth on the amorphous layer may be etched during thedeposition process by using a dep etch process which is known in the artof building semiconductor circuits. The etch portion of the dep etchprocess utilizes HCl gas to preferentially remove silicon containingmaterials that are not single crystal, which is the case for siliconcontaining materials growing on amorphous silicon. Finally, silicidecontacts are formed on the source and drain layers of the pFET and nFET.

Forming the Second Raised Source Drain Using a Hard Mask

FIG. 2 illustrates the first RSD structure. The CMOS structure is formedas previously described by providing a silicon-on-insulator substratehaving a first substrate surface in a first region and a secondsubstrate surface in a second region, wherein the first substratesurface and the second substrate surface are isolated by a shallowtrench isolation, forming a first gate stack on the first substratesurface and a second gate stack on the second substrate surface, forminga first insulating layer on all exposed surfaces in the first and secondregions, etching the first insulating layer in the second region to forminsulating spacers on sidewalls of the second gate stack, and formingepitaxial source and drain layers on the second substrate surface.

In FIG. 6A, the embodiment describes forming a hard mask layer (610) onall exposed surfaces in the first and second regions. The hard masklayer (610) can be made of, but not limited to, Hafnium Oxide (HfO₂),Zirconium Oxide (ZrO₂), Aluminum Oxide (AlO₂), Silicon Nitride (SiN), oran Hydrogen-rich SiN. The thickness of the hardmask is from about 3 nmto about 25 nm, preferably 12 nm. The hard mask layer (610) in the nFETregion is removed using a wet etch while the pFET region has a resist,protecting it from the wet etch as shown in FIG. 6B. In the nFET region,the first insulating layer (110) is now exposed after etching.

FIG. 6C illustrates the exposed substrate layer. The first insulatinglayer (110) is then etched to (i) form sidewall spacers (108) on thesidewalls of the nFET gate stack (102) and (ii) expose the ETSOIsurface. The epitaxial RSD (150) layers are then grown on the ETSOI ofthe nFET region as previously described. The resist is then stripped offand the hard mask in the pFET region is then annealed at 700 C for 2minutes if the hardmask material is composed of Hafnium Oxide (HfO₂),Zirconium Oxide (ZrO₂), Aluminum Oxide (AlO₂) and 500 C for 2 minutes ifthe hardmask material is composed of SiN.

FIG. 6D illustrates the dual raised source drain structure. To finalizethe structure, the hard mask layer (120) in the pFET region is removedand the silicide contacts on the source and drain layers are formed inboth the first and second regions and on the first and second gatestacks.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

The invention claimed is:
 1. A method of forming a CMOS structure, themethod comprising: providing a silicon-on-insulator substrate having afirst substrate surface in a first region and a second substrate surfacein a second region, wherein the first substrate surface and the secondsubstrate surface are isolated by a shallow trench isolation; forming afirst gate stack on the first substrate surface and a second gate stackon the second substrate surface; forming a first insulating layer on allexposed surfaces in the first and second regions; etching the firstinsulating layer in the second region to form insulating spacers onsidewalls of the second gate stack; forming raised epitaxial source anddrain layers on the second substrate surface; forming an amorphous layeron the source and drain layers on the second substrate surface; etchingthe first insulating layer in the first region to form insulatingspacers on sidewalls of the first gate stack and to expose the firstsubstrate surface; forming in-situ doped epitaxial source and drainlayers on the first substrate surface; removing the amorphous layer andany amorphous material that formed during the formation of the in-situdoped epitaxial source and drain layers; and with the insulating spacersstill remaining on the sidewalls of the first and second gate stacks,forming silicide contacts on the source and drain layers in both thefirst and second regions and on the first and second gate stacks.
 2. Themethod of claim 1, wherein the amorphous layer is formed by depositingan amorphous layer of silicon.
 3. The method of claim 1, wherein theamorphous layer is formed by implanting a neutral species into theepitaxial source and drain layers to convert a top layer into theamorphous layer.
 4. The method of claim 1, wherein forming the in-situdoped epitaxial source and drain layers on the first substrate surfaceis carried out by in-situ etching of amorphous silicon carbide.
 5. Themethod of claim 1, wherein etching the first insulating layer in thefirst region is performed using one of a CF₈, and a CH₂F₂ chemistry thatetches silicon nitride selective to silicon.
 6. The method of claim 1,wherein etching the first insulating layer in the first region isperformed without the use of a lithographically patterned mask.
 7. Themethod of claim 1, wherein the amorphous layer has a thickness of about3 nanometers (nm) to about 20 nm.
 8. The method of claim 7, wherein theamorphous layer has a thickness of about 10 nm.
 9. The method of claim1, further comprising forming a second set of spacers between the raisedsource and drain layers and the insulating spacers on the sidewalls ofthe first and second gate stacks.
 10. A method of forming a CMOSstructure, the method comprising: providing a silicon-on-insulatorsubstrate having a first substrate surface in a first region and asecond substrate surface in a second region, wherein the first substratesurface and the second substrate surface are isolated by a shallowtrench isolation; forming a first gate stack on the first substratesurface and a second gate stack on the second substrate surface; forminga first insulating layer on all exposed surfaces in the first and secondregions; etching the first insulating layer in the second region to forminsulating spacers on sidewalls of the second gate stack; formingepitaxial source and drain layers on the second substrate surface;forming a hard mask layer on all exposed surfaces in the first andsecond regions; removing the hard mask layer in the first region toexpose the first insulating layer by using photolithography to exposethe hard mask layer in the first region and using a wet etch to removethe hard mask layer; annealing the hard mask layer after the hard masklayer is removed from the first region; etching the first insulatinglayer in order to form insulating spacers on sidewalls of the first gatestack and expose the first substrate surface; forming epitaxial sourceand drain layers on the first substrate surface; removing the hard masklayer in the second region; and forming silicide contacts on the sourceand drain layers in both the first and second regions and on the firstand second gate stacks.
 11. The method of claim 10, further comprisingimplanting a neutral species into the hard mask layer before the wetetch to remove the hard mask layer.